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Microstructures and properties of Al-50%SiC composites for electronic packaging applications 期刊论文
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2016, 卷号: 26, 期号: 10, 页码: 2647-2652
作者:  Teng Fei;  Yu Kun;  Luo Jie;  Fang Hongjie;  Shi Chunli;  Dai Yilong;  Xiong Hanqing
收藏  |  浏览/下载:5/0  |  提交时间:2024/05/07
THERMAL-EXPANSION BEHAVIOR  METAL-MATRIX COMPOSITES  VOLUME FRACTION  PARTICLE-SIZE  THERMOPHYSICAL PROPERTIES  SICP/AL COMPOSITES  SIC/AL COMPOSITES  Al-50%SiC composites  powder metallurgy  thermal properties  flexural strength  electronic packaging material