Microstructures and properties of Al-50%SiC composites for electronic packaging applications

YIC-IR

	Microstructures and properties of Al-50%SiC composites for electronic packaging applications
其他题名	Microstructures and properties of Al-50%SiC composites for electronic packaging applications
	Teng Fei 1; Yu Kun 1; Luo Jie 1; Fang Hongjie 1; Shi Chunli 1; Dai Yilong 2; Xiong Hanqing 2
发表期刊	TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA
ISSN	1003-6326
	2016
卷号	26 期号:10 页码:2647-2652
关键词	THERMAL-EXPANSION BEHAVIOR METAL-MATRIX COMPOSITES VOLUME FRACTION PARTICLE-SIZE THERMOPHYSICAL PROPERTIES SICP/AL COMPOSITES SIC/AL COMPOSITES Al-50%SiC composites powder metallurgy thermal properties flexural strength electronic packaging material
英文摘要	Al-50%SiC (volume fraction) composites containing different sizes of SiC particles (average sizes of 23, 38 and 75 mu m) were prepared by powder metallurgy. The influences of SiC particle sizes and annealing on the properties of the composites were investigated. The results show that SiC particles are distributed uniformly in the Al matrix. The coarse SiC particles result in higher coefficient of thermal expansion (CTE) and higher thermal conductivity (TC), while fine SiC particles decrease CTE and improve flexural strength of the composites. The morphology and size of SiC particles in the composite are not influenced by the annealing treatment at 400 degrees C for 6 h. However, the CTE and the flexural strength of annealed composites are decreased slightly, and the TC is improved. The TC, CTE and flexural strength of the Al/SiC composite with average SiC particle size of 75 mu m are 156 W/(m center dot K), 11.6x10(-6)K(-1) and 229 MPa, respectively.
中文摘要	Al-50%SiC (volume fraction) composites containing different sizes of SiC particles (average sizes of 23, 38 and 75 μm) were prepared by powder metallurgy. The influences of SiC particle sizes and annealing on the properties of the composites were investigated. The results show that SiC particles are distributed uniformly in the Al matrix. The coarse SiC particles result in higher coefficient of thermal expansion (CTE) and higher thermal conductivity (TC), while fine SiC particles decrease CTE and improve flexural strength of the composites. The morphology and size of SiC particles in the composite are not influenced by the annealing treatment at 400 °C for 6 h. However, the CTE and the flexural strength of annealed composites are decreased slightly, and the TC is improved. The TC, CTE and flexural strength of the Al/SiC composite with average SiC particle size of 75 μm are 156 W/(m·K), 11.6×10~9-6) K~(-1) and 229 MPa, respectively.
收录类别	CSCD
语种	英语
CSCD记录号	CSCD:5860567
引用统计
文献类型	期刊论文
条目标识符	http://ir.yic.ac.cn/handle/133337/35104
专题	中国科学院烟台海岸带研究所
作者单位	1.中国科学院烟台海岸带研究所 2.Cent S Univ, Sch Materials Sci & Engn, Changsha 410083, Hunan, Peoples R China
推荐引用方式 GB/T 7714	Teng Fei,Yu Kun,Luo Jie,et al. Microstructures and properties of Al-50%SiC composites for electronic packaging applications[J]. TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA,2016,26(10):2647-2652.
APA	Teng Fei.,Yu Kun.,Luo Jie.,Fang Hongjie.,Shi Chunli.,...&Xiong Hanqing.(2016).Microstructures and properties of Al-50%SiC composites for electronic packaging applications.TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA,26(10),2647-2652.
MLA	Teng Fei,et al."Microstructures and properties of Al-50%SiC composites for electronic packaging applications".TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA 26.10(2016):2647-2652.